The Higher Education Loans Board (HELB) has opened applications for its 2026/2027 Partial Postgraduate Scholarship Programme, inviting eligible Kenyan students pursuing master’s and doctoral studies in local universities to submit applications.
In a notice issued on Thursday, HELB said the scholarships are available to students enrolled in accredited public and private universities recognised by the Commission for University Education (CUE).
The programme aims to support postgraduate students undertaking studies in Science, Technology, Engineering, Mathematics (STEM) and agriculture-related disciplines.
Scholarship awards for master’s and PhD students
Successful applicants pursuing master’s degrees will receive Sh200,000, payable over a two-year period, while PhD candidates will be awarded Sh450,000, spread across three years of study.
According to HELB, the scholarships are intended to reduce the financial burden faced by postgraduate students while supporting the country’s investment in research, innovation and skills development.
Eligibility requirements
Applicants must be Kenyan citizens admitted to master’s or PhD programmes at universities recognised by the Commission for University Education.
To qualify, candidates are required to have attained at least a Second Class Upper Division in their undergraduate studies and possess a valid admission letter for an eligible postgraduate programme in STEM or agriculture.
HELB further stated that previous beneficiaries of its loan programme must either have fully repaid their loans or be actively servicing them before applying for the scholarship.
Application process
Interested students are required to submit their applications online through the Higher Education Financing (HEF) portal.
Applicants must also pay a non-refundable application fee of Sh3,000 via the eCitizen platform before completing the submission process.
HELB encouraged eligible students to apply early and ensure they provide accurate information during the online application process.
Warning against fraudsters
The board cautioned applicants against individuals claiming they can influence the scholarship selection process or fast-track applications in exchange for payment.
HELB emphasised that the application and evaluation process is fully automated and does not require applicants to engage agents or intermediaries.
The board urged prospective beneficiaries to rely only on official HELB communication channels when seeking information about the scholarship programme.
Deadline for applications
Applications for the 2026/2027 Partial Postgraduate Scholarship Programme will close on August 31, 2026.
The announcement comes weeks after HELB opened applications for first-time undergraduate and Technical and Vocational Education and Training (TVET) loans and scholarships for the 2026/2027 academic year.
The board has advised all eligible students to submit their applications before the deadline and carefully follow the prescribed application guidelines to avoid delays or disqualification.
